Description:
· The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Skill sets required not limited to the following:
· Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred.
· Knowledge of packaging material property and behavior is beneficial.
· Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
Minimum educational qualification:
· AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development. Must be able to stand and work for at least 6 hours.
Job Type: Contract
Pay: $26.00 - $28.00 per hour
Schedule:
- 8 hour shift
Education:
- Associate (Required)
Experience:
- Failure Analysis: 1 year (Required)
- X-Section: 1 year (Required)
Work Location: In person
