Test & Plating Process Engineer (MES Project)

location_onKuala Lumpur, Malaysiaschedule17 jam lalu
badgePekerjaan:Sepenuh masa
historyPengalaman minimum:2+ tahun
schoolPendidikan:Ijazah sarjana muda

Penerangan kerja

Change the world. Love your job.

Texas Instruments is seeking a Process Engineer to lead the digital design of our Test & Plating manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key

Responsibilities

  • MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
  • Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.
  • Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment.
  • Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Minimum

requirements

  • Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
  • Strong hands-on semiconductor process experience in Test & Plating, with minimum 2 years of relevant experience
  • Strong foundation in statistical process control, engineering change control and process release strategies

Preferred

qualifications

  • Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
  • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
  • Experience in optimizing process parameters for wedge bonding or die attach accuracy.
  • Demonstrated strong analytical and problem solving skills
  • Strong verbal and written communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Demonstrated ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for result

Kemahiran yang dinyatakan


Kuala Lumpur, Malaysia
ti.com

Our passion is to create a better world by making electronics more affordable through semiconductors. For nearly a century, we have been pioneers in the transition from vacuum tubes to transistors and then to integrated circuits, advancing semiconductor technology to make it smaller, more efficient, more reliable and more affordable. Our semiconductor chips can be found in every type of electronic system - from electric vehicles to industrial robots, solar panels to satellites. We design, manufacture, test and sell analog and embedded processing chips that serve as the essential building blocks of electronic systems. Our approximately 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data, and provide the core control or processing in their designs. Operating across industrial, automotive, personal electronics, communications equipment and enterprise systems markets, our 34,000 employees worldwide continue to engineer progress, solving complex challenges that enable a smarter, safer and more sustainable future.

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