Process Engineer – Semiconductor Bonding Wire Manufacturing

About the Role

Looking to advance your engineering career in semiconductor manufacturing? Join a specialised manufacturing environment focused on bonding wire technology, where you will optimise production processes, troubleshoot technical issues and drive continuous improvement in product quality, yield and manufacturing efficiency.

Key Responsibilities

• Optimise manufacturing processes involving metal casting, mechanical deformation, thermo-mechanical treatment and bonding wire coating.
• Evaluate new machinery, products, manufacturing processes and raw materials.
• Monitor process parameters, investigate production issues and resolve product quality concerns.
• Analyse process variations and implement corrective and preventive actions to improve yield and product reliability.
• Support daily manufacturing operations, including process control, equipment performance, quality assurance and shipment requirements.
• Collaborate with Manufacturing, Maintenance, New Product Introduction (NPI) and Quality Assurance teams to improve workflows and update FMEA, Control Plans and SOPs.
• Drive continuous improvement projects involving yield enhancement, scrap reduction, productivity, cost savings and on-time delivery.
• Monitor statistical process control (SPC) metrics and prepare performance reports.
• Work with suppliers and external partners on equipment development, automation and Industry 4.0 initiatives.
• Lead or participate in process improvement projects to enhance manufacturing efficiency and product performance.
• Initiate production lot holds and recommend rework or disposition actions in accordance with quality procedures.

• Business Edge Personnel Services Singapore
• EA License No: 96C4864

EA Personnel Reg No: R26159908 (Tan Ying Ying)