GDevice Technology Deployment Manager – Assembly & PackagingGenentech·χθεςbookmark_borderlocation_onHolly Springs, Ηνωμένες Πολιτείεςpayments$109.900 – $204.100/yrsync_altΥβριδικόbadgeΑνώτεροςAutomationGmpIso 13485Negotiation+5
GPrincipal Project Engineer Packaging & Device Assembly (US)Genentech·χθεςbookmark_borderlocation_onHillsboro, Ηνωμένες Πολιτείεςpayments$109.900 – $204.100/yrhomeΤηλεχειριστήριοbadgeenum.seniority.principalwork_historyΣυμβόλαιοAutomationCalendar ManagementGmpOperations Management+1