GDevice Technology Deployment Manager – Assembly & PackagingGenentech·그저께bookmark_borderlocation_onHolly Springs, 미국payments$109,900 – $204,100/년sync_alt하이브리드badge시니어AutomationGmpIso 13485Negotiation+5
GPrincipal Project Engineer Packaging & Device Assembly (US)Genentech·그저께bookmark_borderlocation_onHillsboro, 미국payments$109,900 – $204,100/년home원격badgeenum.seniority.principalwork_history계약직AutomationCalendar ManagementGmpOperations Management+1